"Sensor/IC Integration using Oxide Bonding" --WITHDRAWN--
Presented by Dr. Ronald LIPTON
We report on the testing of sensors bonded to readout chips using "Direct Bond Interconnect" (DBI) technology. DBI utilizes an oxide bond on the sensor and IC surfaces to form a robust interconnect which also serves to form the metal interlayer contacts. The techology has demonstrated 3 micron pitch. We report on tests of sample sensor chips bonded to BTeV FPIX2 wafers and thinned to 100 microns.
Location: University of Illinois - Chicago