From settles@mppmu.mpg.de Fri Jan 18 15:50:31 2008 Date: Fri, 18 Jan 2008 15:46:14 +0100 (CET) From: Ronald Dean Settles To: lctpc@desy.de Subject: [lctpc] Draft Summary: WP#46pt5 09.01.2008/Tsinghua on LCTPC electronics/advanced endcap Dear LCTPC colleagues, We had an "advanced endcap" meeting durint the TPC school at Tsinghua last week. I am numbering this WP#46.5 since the next meeting (#47) was held this week after the Zeuthen ILD meeting. Here is a draft summary, and comments/corrections are welcome... Best greetings, Ron WP#46.5: LCTPC electronics/advanced endcap 9January2008 ---------------------------------------------------- Wednesday 9 January 2008 Tsinghua U 15:30-17:30 Agenda ------ 1. Status - Luciano 2. Next steps, possibilites for Asian involvement - Discussion Reminder of steps last year: --June 14: Video/phone meeting with prepared talks. --July 26: Video/phone meeting with prepared talks. --After the October 8-10 Eudet annual meeting in Paris, face-to-face "Advanced-endcap" meeting on October 10 afternoon. Attendees --------- -Paul Colas paul.colas@cea.fr -Zhi Deng dengz@mail.tsinghua.edu.cn -Takahiro Fusayasu fusayasu.takahiro@nias.ac.jp -Keisude Fujii keisuke.fujii@kek.jp -Takeshi Matsuda takeshi.matsuda@kek.jp -Luciano Musa luciao.musa@cern.ch -Ron Settles settles@mppmu.mpg.de -anybody forgotten? Summary ---------------- 1. Luciano went through his slides from the Paris meeting: http://ilcagenda.linearcollider.org/conferenceDisplay.py?confId=2260, click on "slides" and then "1a)ctpc_musa" (sorry for the typo) and "4)lctpc_musa_rob". An interim status was given by Takesha at ALCPG07, click on his slides at http://ilcagenda.linearcollider.org/conferenceDisplay.py?confId=2289 The general purpose readout chip consistz of (see 1a)ctpc_musa) a programmable amplifier (PCA) and digitizer (ADC) in 130nm technology under development at CERN. The PCA part was submitted last May and delivered in October and now needs to be tested. With an expected IC area (see 4)lctpc_musa_rob) of about 1.5mm^2/channel, a 64 channel chip would occupy about 100mm^2. (NB, this is a large chip, so the final decision on #channels/chip will depend on the expected yield). These would be mounted directly on the PCB with pads on one side and chips on the opposite side (sometimes called "chip on board") using a "flip-chip" bump-bonding scheme. The pad-IC connection would take place using an eight-layer board (no. layers t.b.d. since the layout is still very provisional). A PCB 40 x 40 cm^2 panel could encompass up to 53000 pads (ca. 3mm^2/pad). (The pad size is also t.b.d. of course.) In this scenario, there would be 800 FEE chips per board. The heat generated would be 8/4/10 mW/channel for the amplifier/digital-processor/power-regulator, and taking into account a power-switching duty cycle of 1% the cooling would have to handle 167 W/m^2; this would mean that some kind of liquid cooling would be needed in addition to air cooling. The amount of current to be switched would be mitigated by storing the energy locally in capacitors. The material thickness for this part of the endcap would be a couple of percent. In addition there will be material for circuits to get the data out and for the mechanics to provide the stiffness, positioning and cooling. A total thickness of around 15%X_0 for the endcap would be estimated for in this scenario. 2. Takahiro Fusayasu (and Hirokazu Ikeda who was not at this meeting) expressed interest in this development. Zhi Deng mentioned setting up the Alice RO scheme for the TsinghuaU-TPC (see Yulan's TPC-School talk at http://ilcagenda.linearcollider.org/conferenceDisplay.py?confId=2507) and his interest in the pixel (medipix, timepix, etc) development. How to proceed? Luciano said that the general steps are: review the "advanced-endcap" layout, contact a PCB firm, build a prototype. An immediate need is to test the new PCA. Luciano willdiscuss with Sandro Marchiro at CERN next week about finding an electronics expert for this. Takahiro Fusayasu would be interested in doing this if travel, etc can be arranged. Zhi Deng could also help on the general advanced endcap development, first for standard electronics now and the for pixel electronics later.