SiW EUDET Module - Technical Meeting

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Hello Roman Poeschl, You have BOOKED a meeting in EVO (http://evo.caltech.edu). Title: EUDET Module Description: Development of EUDET Module Community: CALICE Password: calice Meeting Access Information: - Meeting URL http://evo.caltech.edu/evoGate/koala.jnlp?meeting=M2MvMB2a2iDsD8999iDM92 - Password: calice - Phone Bridge ID: 1087341 Password: 0771 Coordinated Universal Time (+0000) Start 2009-06-30 14:00 End 2009-06-30 16:00 Japan Standard Time (+0900) Start 2009-06-30 23:00 End 2009-07-01 01:00 Central European Summer Time (+0200) Start 2009-06-30 16:00 End 2009-06-30 18:00 Eastern Daylight Time (-0400) Start 2009-06-30 10:00 End 2009-06-30 12:00 Pacific Daylight Time (-0700) Start 2009-06-30 07:00 End 2009-06-30 09:00 EVO Phone Bridge Telephone Numbers: --------------- - USA (Caltech, Pasadena, CA) +1 626 395 2112 - Switzerland (CERN, Geneva) +41 22 76 71400 - Slovakia (UPJS, Kosice) +421 55 234 2420 - Italy (INFN, several cities) http://server10.infn.it/video/index.php?page=telephone_numbers Enter '4000' to access the EVO bridge - Germany (DESY, Hamburg) +49 40 8998 1340 - USA (BNL, Upton, NY) +1 631 344 6100 - United Kingdom (University of Manchester) +44 161 306 6802 - Australia (ARCS) +61 0261128742 Canberra 0282124591 Sydney 0362370281 Hobart 0386858362 Melbourne 0731390705 Brisbane 0884631011 Adelaide 0864616718 Perth - Netherlands (Nikhef, Amsterdam) +31 20 7165293 Dial '2' at the prompt - Canada (TRIUMF, Vancouver) +1 604 222 7700 - Czech Republic (CESNET, Prague) +420 95 007 2386
Roman Poeschl
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1) M. Anduze: Mechanics Brainstorming - The brainstorming allowed to bring everybody in sync on the dimensions envisaged for the EUDET. Module. In particular the thickness of the PCB was once more clarified. A number of proposals to improve the thermal tests have been pondered, essentially the heat evacuation will be based on a copper (pcb-cover)-copper (thermal drain) contact. 2) J. Giraud - Results of thermal tests - Presentation of ideas for thermal tests in alveolar structure Timeline for next steps (mechanics): - Repetition of thermal tests (outside alveolar structure) according to 1) beginning of september - Integration of thermal layer into alveolar structure by mid september (start with first thermal layer for test) - Thermal tests according to 2) by end of september Detailed dates to be agreed 3) R. Cornat - News on electronics - Establishement of first chain ASU (Wafer/FEV7_CIP/SPIROC) - Adapter Board (Did get ready in time 2/7/09) - DIF - EUDET DAQ during July with the aim to be able to readout 'real' signals until Lyon Meeting Main open issues: - LDA? - Contact Adpater Board FEV7 <-> to be realised - Programming of Chip via DIF? - Promising results from SPIROC (in SKIROC mode) characterisation. Nice linearity of ADC, 4) R. Poeschl: News - Start to establish collaboration with CERN for industrialisation of SiW Wafers. Next Meeting: 21/7/09 900h UTC
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