These are the minutes of the Meeting of the 21/7/09
- Electronics Testbench (by Remi Cornat)
ECAL:
The DIF board, the prototype adapter board are now coupled. The tesst are ongoing with USB (massive transfers with random numbers).
The DIF firmware is being implemented into the DIF fpga (DEV0 version: simulation OK, P&R ongoing).
Next step : electrical tests + connect the FEV7_CIP
Remark by P. Cornebise: The soldiering of the adapter board to the PCB will be realised at the beginning
of September, as the technique developped for the thermal board is not directly applicable to the protoype
currently under study, in addition new soldiering paste needs to be ordered.
DAQ:
All the DAQ hardware is now at LLR (PC+ODR+LDA+(DCC)+DIF).
The setup of the chain begins enabling transfers on hdmi link (DCC+DIF).
This work is common to ECAL and DHCAL.
- News on SPIROC2 (presented by R.P. based on work at LAL)
SPIROC2 chips were further examined. This time the signal has been injected at the
very beginning of the signal propagation chain.
The net outcome is that the Chip show a equally distributed response if signals are injected
synchronously on all channel, while mostly only the desired channel responds in case
the signal is fed only into one channel. The level of cross talk is thus relatively small (Exact number to
be quantified !!!).
- Demonstrator - Continuation of (thermal) tests
Technical specifications for the construction of the slabs for the 'in-alveolar' thermal tests were
given. In particular the specs for the simplified layers, which will surround the 'real' thermal slab
were given, in terms of thickness power dissipation and material budget.
The dummy layers will be fabricated according to the spacs at LAL. The test will be conducted at LAL towards the
end of September, together with other still outstanding thermal tests, e.g. modified contact Cu-Shielding - Thermal ASUs.
- Support for Layer manipulation
At LAL a support to handle the fragiles ASU lines has been manufactured. the single layers will be lifted
by sucting them with vacuum onto a flat surface. Once sucted to the manipulator the layer can easily be carried around, and placed precisely e.g. onto the H Board. This technique has been successfully applied for the demonstrator and can easily be extended to the (a little bit broader) layers of the EUDET module.
- News from EUDET
The EUDET SC has appreciated a lot our progress and is happy with the status of the project.
However, from the 'Brussels' point of view our device is ready to be used in transnational access.
We have to be a bit creative in inventing applications. Some random ideas
- Testing alternative Si Wafers with the electronics testbench (and successors)
- Integration of alternative Ecal technologies into the alveolar structure
- Testing of alternative cooling systems as e.g. developped at cern
Please feel invited to extend this list, the only caveat is that the person/group requiring transnational access has to come from another european country than the one in which the provided device was developed.
The next meeting on the EUDET Module will be during the last week of August.
Some dates to remember:
- 16/9/09 - 18/9/09 CALICE Collaboration Meeting at Lyon
http://www.ipnl.in2p3.fr/calice09/
- Middle of October EUDET Annual meeting where and when exactly I don't know
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