LLR news - M. Frotin, M. Anduze, D. Jeans
Tests for flattening PCB: recook at 200 degC for 4-5 hours can be used to change the shape, tested on FEV7x board. electrical effects on the intra-pcb connections?
FEV8 will prbably have different characteristics, so don't continue with recooking studies on FEV7 for the time being. If required, can restart these studies on future FEV8.
Launching collaborations with companies to perform the fibre Bragg grating measurements.
Tests of single layer - July and August, final assembly can start in September. Still a few small changes to be made to the mould for assembly.
DAQ system starting to work with FEV7-CIP board, a lot of recent progress.
ASICs can be configured, and data read from ASICs.
Adapter board designed, manufactured by end August.
LAL news - P Cornebise, R Poeschl
New connectors for the Bragg grating fibres have arrived.
Contact with local company ("Copenmar"?) for PCB interconnections. possibility of no-(or low-)pressure connection technique. Meeting with company in a 2 weeks.
Trip to CERN with Stéphane end June.
Discussions about PCB planarity and filling of wells with epoxy.
several comanies in the Geneva region may have relevant experience to advance these subjects.
LPNHE news - P. Ghislain, D. Lacour, L. Lavergne
testing of gluing procedure using plexiglass "PCB" and glass "sensor"
different configurations of pressure and pressing time tested.
next step to use the full setup with two vacuum tables.
adapt the procedure to apply glue to the PCB, rather than the sensors.
easier to clean PCB in case of problems.
requires some changes to the setup (one extra table).
(Marc showed results of some previous gluing studies.)
future dates
next meeting beginning september
beam tests envisaged for september (parasitic to DHCAL @ PS) and november (@ DESY): single layer FEV7, SPIROC2, 1 sensor, DAQ2
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