Name: Si sensor meeting with Hamamatsu
Start: 2010-09-07T08:00:00+02:00
End: 2010-09-07T18:00:00+02:00
Location: No location set

08:00 → 08:20

intro to HPK 20m

Speaker: Masaru SAWAKI (HPK)

08:20 → 08:40

intro to LLR 20m

Speaker: Jean-Claude Brient

08:40 → 09:00

ILC/ILD/SiW-ECAL 20m

Speaker: Daniel Jeans (Ecole Polytechnique)

09:00 → 09:20

Si sensor status 20m

Speaker: Dr Remi Jean Noel Cornat (CNRS/IN2P3/Laboratoire Leprince-Ringuet (LLR))

09:20 → 09:40

discussion 20m

morning: ******** present: Kawagoe, Takeshita, JCB, Remi, Daniel, Roman * Takeshita ----------- ECAL Base Unit, developed with DESY & Korea EBU: 2011 summer 1 module ready then rehearsal of afternoon session afternoon ********* present from HPK solid state div: Yamamoto (director) Sawaki, Inuzuka (sales div) Yamamura, Kosugi * Sawaki: intro to HPK solid state * JCB: intro to LLR * DJ: intro to LC, SiW ECAL * RC: Si sensors then discussion (largely Yamamoto) - 2$/cm2 seems very cheap. some mention of 5$ (in japanese only) - dead area at edge ~ 2*thickness - future laser cutting of wafer: cleaner cut than diamond saw, maybe able to reduce edge width - 5 years production ~ OK - 8" wafer 20/30% higher cost than 6", ~2*area (save on polishing) 8" assembly lines more developed, easier to extend size trends upward - lower quality Si, probably OK for <500 micron - thick wafer not so good - 8", 400-500 micron -> not too fragile - new 8" production line just started production. takes 2 years to complete - leakage current requirement not major cost factor those which fail are typically much above the requirement - testing not very costly - cost drivers: material 20/30% processing # matrices per wafer - 80-90% yield - >50% no problem, ~20% one small defect (these numbers not so consistent!) - for 2011 stay with 6" wafer internal HPK tests with 8" * if OK then can send to us to test - for 2012 parallel 6", 8" - for DBD, keep with 6" technology - 8" wafer for later (2013) incl. cost estimates something like testbench for new HPK production line - PhD topics: compare 6/8" end 2011? co-supervise: Kobe/Shinshu/HPK - EP (HPK seem to prefer a Japanese) - laser cutting. "T" cut. much better quality & control. - dC/dV @ nominal bias voltage - next step: RC define looser requirements production next summer - HPK decide best design: depends on thickness we are relatively flexible, but >300 micron (to limit fragility) - HPK will try 2 or 3 different GR designs, cutting methods in 6"/8" - visit again next spring (March) around CALICE mtg