ICEPP, Fac. of Science Bldg 1, U.Tokyo Hongo Campus
Description
For a moment, the talks are not grouped in sessions, their order will be changed
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Meeting Number: 25954082
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- thickness of silicon sensors, other possible discussions with Hamamatsu
- new Si sensor tests
- preparation to CERN TB: goals, readiness criteria, tungsten+mechanics
- new technological prototype tests to be made
- new SKIROC production