- Baseline for Design is supposed to be Option 3 on Slide 5 of my Presentation
Current assumption: 1.2mm Thickness for PCBs.
Do we need to groove holds into the copper (heat) shield in that case, if yes which size?
Can we live with the resulting potential 20% loss in longitudinal granularity from the physics point of view?
*Design for EUDET Module has to be pinned down during September!!!*
- How to mimic the DIF for the Demonstrator?
- Adapter Card for the Demonstrator?
After overcoming the network problems at Cambridge, Maurice pointed out that also the
Adapter Card between the ASUS and the DIF will dissipate heat and would need to be mimicked
with the demonstrator => Details to be clarified soon.