EUDET Mechanics meeting

Thursday 28 Aug 2008, 15:00 → 17:00 Europe/Zurich

EVO meeting

15:00 → 15:20 EUDET Prototype – The next months

Speaker: Roman Pöschl

Slides talk280808.pdf

15:20 → 15:40 News on Moulds & Structures

Speaker: Marc Anduze

Slides 080909_EUDET_struct_status.pdf

15:40 → 16:00 SLAB COOLING

Speaker: Denis grondin

Slides 28-08-08_Confcall_LPSC-V1.pdf

16:00 → 16:20 PCB for thermal studies

Speaker: Patrick Cornebise

Slides carte_test_temperature_PPT.pdf

16:20 → 16:40 Discussions (all participants)

- Baseline for Design is supposed to be Option 3 on Slide 5 of my Presentation Current assumption: 1.2mm Thickness for PCBs. Do we need to groove holds into the copper (heat) shield in that case, if yes which size? Can we live with the resulting potential 20% loss in longitudinal granularity from the physics point of view? *Design for EUDET Module has to be pinned down during September!!!* - How to mimic the DIF for the Demonstrator? - Adapter Card for the Demonstrator? After overcoming the network problems at Cambridge, Maurice pointed out that also the Adapter Card between the ASUS and the DIF will dissipate heat and would need to be mimicked with the demonstrator => Details to be clarified soon.