minutes of ECAL mech-elec mtg
21 June 2011
Wafer gluing: Patrick Ghislain LPNHE
presented scheme for gluing of sensors to PCB using robot @ LPNHE
tests will start on
- size of glue dots (previous proto test data exists from Marc Anduze)
- one PCB in hand (3 more available @ LLR)
- (small) sample of glue has arrived
ASU planarity simulations: Julien Bonis LAL
- simulate a warped PCB 1mm deflection, continuous glue layer, si sensor
- glue is the weak point, will not hold a 1mm deflection (or right at the limit)
- max deflection of 0.5mm desirable (order of magnitude)
Endcap mechanical simulations: Julien Giraud LPSC
- wide vs narrow rails
- stresses in horizontal endcap modules
could be critical issue
try increasing CF thickness
may need to think of alternative layouts/designs
(module design not at all optimised for the horizontal orientation)
- LLR can do tests of "I" structure with shear forces
discussions
- PCB planarity
need to accelerate towards 16 cavity PCB design
-> initially not all routage required
-> more fruitful dicussions with manufacturers
-> more symmetrical => maybe flatter
some tests with FEV7 have already been done (Stephane/Rémi)
-> no problems found so far
-> should not hold back on 16 cavity design development
think about other solutions
e.g Kevlar-based PCB...probably expensive, but interesting to investigate
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